Your search returned
9
records. Click on the hyperlinks to view further details of Titles..
Magazine Name
:
Mrs Bulletin
Year :
2003
Volume number :
28
Issue:
01
Microelectronics Packaging And Integration
(Article)
Subject
:
Pack Leaks
Author:
R.H. Reuss
page:
11 -
20
Critical Aspects Of High-Performance Microprocessor Packaging
(Article)
Subject
:
Critical Aspects
Author:
V.P. Alturi
page:
21 -
34
Materials For 3d Packaging Of Electronic And Optoelectronic Systems
(Article)
Subject
:
Material & Experimental Methods
Author:
V.H. Ozguz
page:
35 -
40
High-Performance Pakaging Of Power Electronics
(Article)
Subject
:
High Rate Wireless Data
Author:
M.C. Shaw
page:
41 -
50
Emerging Materials Challenges In Microelectronic Pakaging
(Article)
Subject
:
High-Performance
Author:
D.R. Frear
page:
41 -
50
Packaging Options For Mems Devices
(Article)
Subject
:
Options Diversion
Author:
E Jung
page:
51 -
54
Packaging Options For Mems
(Article)
Subject
:
Water
Author:
R. P Gooch
page:
51 -
54
Low-Cost Water Level Vaccum Packaging Or Mems
(Article)
Subject
:
Cost Allocation
Author:
R Gooch
page:
55 -
60
Chip-To-Module Interconnections Using "Sea Of Leads " Technology
(Article)
Subject
:
Microprocessor
Author:
M.S Bakir
page:
61 -
67
